High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

<span class="field field--name-title field--type-string field--label-hidden">High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method</span> <span class="field field--name-uid field--type-entity-reference field--label-hidden"><span> 431279_sandyge… </span> </span> <span><time datetime="2026-10-15T08:01:29-05:00" title="Thursday, October 15, 2026 - 08:01 CDT" class="datetime">Oct 15, 2026</time> </span> <div class="field field--name-field-date field--type-datetime field--label-hidden field__item"><time datetime="2026-10-15T12:00:00Z" class="datetime">Oct 15, 2026</time> </div> <div class="clearfix text-formatted field field--name-body field--type-text-with-summary field--label-hidden field__item"><p>High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, <a href="https://www.electronics.org/sites/default/files/test_methods_docs/TM%202.2.23.pdf">IPC-TM-650-2.2.23</a>, based on the results of HDP’s <span>Non-Contact Copper Foil Profile project</span>.&nbsp;</p><p>“This is a significant development as it relates to high-speed, high-performance applications where lower profile copper roughness is necessary,” said Larry Marcanti, Executive Director of HDP User Group. “We thank Tsuyoshi Hiroaki-san of Mitsui-Kinzoku for his leadership of the Non-Contact Copper Foil Profile project and his continued leadership and efforts in the Correlating Copper Foil Profile to Signal Integrity project."&nbsp;</p><p>“The work done by HDP provided us with the empirical data necessary to create this new test method,” said Matt Kelly, CTO, VP Technology Solutions at Global Electronics Association. “We are excited to continue and grow our collaboration with HDP, ensuring standards and test methods keep pace with the latest technology developments and are backed by strong technical data.”</p></div> <div class="field field--name-field-terms-reference field--type-entity-reference field--label-hidden field__items"> <div class="field__item content-tag content-tag--ipc-standards"><a href="https://www.electronics.org/primary-categories/ipc-standards" hreflang="en">IPC Standards</a></div> </div> <div class="field field--name-field-terms-reference-2 field--type-entity-reference field--label-hidden field__items"> <div class="field__item content-tag content-tag--high-density-packaging"><a href="https://www.electronics.org/secondary-categories/high-density-packaging" hreflang="en">High Density Packaging</a></div> <div class="field__item content-tag content-tag--test-methods-"><a href="https://www.electronics.org/secondary-categories/test-methods" hreflang="en">test methods </a></div> </div> <div class="field field--name-field-list-image field--type-entity-reference field--label-above"> <div class="field__label">List Image</div> <div class="field__item">copper traces on a printed circuit board.jpg</div> </div> <drupal-render-placeholder callback="flag.link_builder:build" arguments="0=node&amp;1=7842&amp;2=bookmark_to_favorites" token="onbht-Shki2DxLT0jGsxeuz7cDLCi1s1RHLzWRM5HZw"></drupal-render-placeholder>

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Global Electronics Association (formerly IPC) - news and market reports RSS · Trade Publication

Published

15th October 2026

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electronics.org

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